3D-MID: 3D Mechatronic Integrated Devices are three-dimensional bodies with integrated circuit structures.
The metallized thermoplastic part (MID) replaces the circuit board plus additional components, which usually consists of many different materials. The 3D-MIDs are made of recyclable thermoplastics and are easier disposed of than conventional circuit boards.
MIDs allow a quicker production of circuits and a much faster design renewal at a favorable price.
A 3D-MID offers the following advantages:
• Shorter process chains
• Savings achieved through using less components
• Higher functional reliability
Where is 3D-MID being used?
3D-MID is now found throughout the entire range of electronics.
It is used where a higher integrity of electronics is needed, e.g. where size and weight is relevant 3D-MID offers the best solutions.
Before serial production there is the prototype
Our main challenge was to produce a prototype faster and more economically, which we were not able to achieve before with the conventional design process of 3D-MIDs.
The injection molded 3D-MIDs, as used in serial production require expensive injection molding tools and long production times – laser sintered prototypes are manufacturable at relatively low price.
• Faster design cycles
• Batch production at lower costs
How is a 3D-MID prototype developed?
Layout software for 3D-MIDs
With TARGET 3001! V18 PCB-POOL® version, the first free ECAD software is available for designing electronic circuits on three-dimensional circuit carriers.
To download please click here.
This video tutorial shows the software function and explains the individual steps for creating a 3D-MID.