3D-MID: 3D Mechatronic Integrated Devices are three-dimensional bodies with integrated circuit structures.
The metallized thermoplastic part (MID) replaces the circuit board plus additional components, which usually consists of many different materials. The 3D-MIDs are made of recyclable thermoplastics and are easier disposed of than conventional circuit boards.
MIDs allow a quicker production of circuits and a much faster design renewal at a favorable price.
A 3D-MID offers the following advantages:
• Shorter process chains
• Savings achieved through using less components
• Higher functional reliability
Where is 3D-MID being used?
3D-MID is now found throughout the entire range of electronics.
It is used where a higher integrity of electronics is needed, e.g. where size and weight is relevant 3D-MID offers the best solutions.
Before serial production there is the prototype
Our main challenge was to produce a prototype faster and more economically, which we were not able to achieve before with the conventional design process of 3D-MIDs.
The injection molded 3D-MIDs, as used in serial production require expensive injection molding tools and long production times – laser sintered prototypes are manufacturable at relatively low price.
• Faster design cycles
• Batch production at lower costs
How is a 3D-MID prototype developed?
Software di layout gratuito per progettazione 3D MID
Con TARGET 3001! V18 nella versione PCB-POOL® mettiamo a disposizione il primo software EDA gratuito per la progettazione di circuiti elettronici su dispositivi di interconnessione tridimensionali. Il download del software, è disponibile qui.
Il video tutorial illustra le funzioni del software e spiega in dettaglio i passaggi per la creazione di un dispositivo 3D MID