Flexible printed circuit boards

MADE IN GERMANY

Flex printed circuit boards are the method of choice for making engineering work easier when complex geometries are involved.

Savings on space, weight and cost together with increased reliability of the electrical connections are just some of the benefits provided by flexible printed circuit boards.

Our PCBs in the Flex Pool are exclusively manufactured in Germany.

PRICE CALCULATION

The minimum surface area for calculating the base price is 1 dm².
A surface area of up to 5 dm² is possible in the Flex Pool.
We offer delivery times of 10, 16 or 22 business days.
Please feel free to have larger unit quantities calculated using PCB-OVERSEAS.

You can conveniently perform the calculation of your single-sided or double-sided Flex circuit boards in our Online order system.

Business days Base price factor   
22 1.0   
16 1.3   
10 1.7

The base price factor 1.0 corresponds to the following standard delivery times for single-sided or double-sided flexible PCBs: 22 business days.


BASE MATERIAL

We always use polyimide films as the base material. They provide various advantages over other films. LCP, PEN, and PET films have various drawbacks such as low temperature resistance or a high price.

Property Polyimide
Copper adhesion > 0.7 N/m
Dielectricity constant 3.6 (1 MHz)
Stability in the soldering bath 288°C (> 10 s)
Expansion < 0.2%

FLEXIBLE PROTECTIVE FILMS

A Kapton®/acrylic based cover is used in the Flex Pool. It ensures, for example, high dielectric strength.

PROPERTIES OF THE MATERIALS

The polyamide film materials used in our Flex technology differ from rigid circuit board materials in essential respects:
• The copper adhesion decreases considerably with increasing temperature
• The material absorbs six times more water than FR4
• Greater production tolerances due to larger dimensional changes in the production process

Download our data sheet here as needed.

LAYOUT RECOMMENDATIONS

• Bending radius of around 6 x the Flex material thickness for single-sided Flex layers and around 12 x the Flex material thickness for double-sided Flex layers
• Select the greatest possible conductor path widths and clearances in the Flex range
• The bending area should have parallel, equally wide conductor paths running vertically to the bending line and having the same insulation resistance.
• Continuously tapered transitions from wide to narrow conductor tracks are optimal.
• Transitions from wide to narrow conductor tracks in the 90°angle should be made using the largest possible radii.
• The conductor paths on double-sided flexible parts should be symmetrically offset
• Provide large, cut-out Cu surfaces in the layout if possible
• Select soldering surfaces to be as large as possible - select soldering point diameters at least twice as large as the hole diameters
• Design conductor path connections to the soldering points to be droplet-shaped and rounded.
• Size cover film openings which are not photo-structured to be around 1 mm larger in circumference
• Always provide smooth (round) milling transitions
• Provide additional copper paths as tearing protection on the target bending points for flexible jibs
• Partial mechanical reinforcements can be added in the mating or assembly areas (thickness: 0.3 mm).
Please note: If your stiffener material within your circuit design is not located on the edge of the pcb (e. g. connectors) please request a quotation.

PROCESSING

The flexible circuit boards must be dried during the assembly and soldering process. They must then be processed within 8 hours.

Please note the data sheet "Drying (tempering) circuit boards".

TECHNICAL PARAMETERS

Number of layers 1-2
Copper Single-sided or double-sided
Surface Chemical tin
Film material Polyimide
Polyimide thickness 50 μm
Copper thickness 18 µm
Circuit board thickness 0.2 mm
Max. size of the circuit board Length: 400 mm / Width: 250 mm
Min. size of the circuit board Length: 10 mm / Width: 35 mm
Flex cover film Clearance: 500 μm
Min. conductor width / conductor clearance 150 μm
Vias Via diameter: 300 μm
Min. via-via spacing 450 μm
Min. milling radius 500 μm
Min. copper-contour clearance 300 μm

Download our data sheet here as needed.